Tapered LIGA HARMs

被引:27
作者
Turner, R [1 ]
Desta, Y
Kelly, K
Zhang, J
Geiger, E
Cortez, S
Mancini, DC
机构
[1] Louisiana State Univ, Dept Engn Mech, Baton Rouge, LA 70803 USA
[2] Ctr Adv Microstruct & Devices, Baton Rouge, LA USA
[3] Argonne Natl Lab, Argonne, IL 60439 USA
关键词
D O I
10.1088/0960-1317/13/3/303
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The standard LIGA process takes advantage of the use of x-ray lithography to produce mold inserts with nearly vertical sidewall; the typical slope of patterns produced by x-ray lithography of polymethylmethacrylate is 0.1%. This lack of significant taper (draft angle) greatly increases the difficulty associated with ejecting parts during demolding. In this paper, a procedure is described to fabricate a mold insert with tapered features having a height of approximately I mm and lateral dimensions of approximately 300 mum. A set of six oblique exposures of a thick layer of SU-8 (an EPON epoxy based negative tone resist) is used to create hexagonal posts with a 3degrees draft angle. An electroforming process is used to fabricate a nickel mold insert with the tapered features. This mold insert is used to injection mold tapered polymer high aspect ratio microstructures. The dimensions of the SU-8 tapered structures (as well as the mold insert) are within 4 mum of desired/predicted values.
引用
收藏
页码:367 / 372
页数:6
相关论文
共 12 条
[1]  
BADE K, 2002, 4 INT WORKSH HIGH AS
[2]  
BLEY P, 1991, JJAP SERIES, V5, P384
[3]   SU-8 as resist material for deep X-ray lithography [J].
Cremers, C ;
Bouamrane, F ;
Singleton, L ;
Schenk, R .
MICROSYSTEM TECHNOLOGIES, 2001, 7 (01) :11-16
[4]  
*CTR ADV MICR DEV, LITH BEAML
[5]   Injection molding of polymeric LIGA HARMs [J].
Despa, MS ;
Kelly, KW ;
Collier, JR .
MICROSYSTEM TECHNOLOGIES, 1999, 6 (02) :60-66
[6]  
JIAN L, 2002, UNPUB MICROSYST TECH
[7]   SU-8 based deep x-ray lithography/LIGA [J].
Jian, LK ;
Desta, YM ;
Goettert, J ;
Bednarzik, M ;
Loechel, B ;
Yoonyoung, J ;
Aigeldinger, G ;
Singh, V ;
Ahrens, G ;
Gruetzner, G ;
Ruhmann, R ;
Degen, R .
MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY VIII, 2003, 4979 :394-401
[8]   Resist dissolution rate and inclined-wall structures in deep x-ray lithography [J].
Liu, Z ;
Bouamrane, F ;
Roulliay, M ;
Kupka, RK ;
Labèque, A ;
Megtert, S .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1998, 8 (04) :293-300
[9]  
MANCINI DC, 2002, P SOC PHOTO-OPT INS, V4557, P77
[10]  
Tabata O, 2002, MICROSYST TECHNOL, V8, P93, DOI [10.1007/s00542-001-0168-0, 10.1007/S00542-001-0168-0]