Residual stress in deuterium implanted nominal copper coatings

The effects of deuterium (D) implantation on the residual stresses in Cu and CuAl2 phases present in nominal Cu coatings (containing Al) deposited on Al-alloy (Al-6061) substrates were measured using an x-ray diffraction technique. The coatings were deposited by radio frequency magnetron sputtering of a pure Cu target under identical conditions and Al was incorporated in the coatings during growth by diffusion from the substrate. Deuterium was implanted in the coatings at energies of 40 or 40+120 keV with fluences of 1 x 10(21), 2 x 10(21), or 3 x 10(21) D+/m(2). Pole figures of the Cu phase in the coatings prior to and after implantation indicated no effect of implantation on the fibrous texture. Triaxial stress analysis indicated the surface normal stress component to be negligible in Cu and slightly tensile in CuAl2 under all conditions. Furthermore, under all conditions, the in-plane residual stresses in both phases were found to be compressive and nearly isotropic. The magnitude of the isotropic compressive stress was always higher in CuAl2 as compared to Cu. The compressive residual stresses in the Cu phase changed only mildly with increasing coating weight, ion energy, and fluence. However, in the CuAl2 phase the compressive residual stresses changed markedly with increasing ion energy (initial decrease followed by leveling off) and increasing ion fluence (initial decrease followed by an increase), but remained unaffected by increasing coating weight. (C) 2000 American Institute of Physics. [S0021-8979(00)07819-1].