Direct fabrication and patterning of Cu2O film by local electrodeposition method

被引：13

作者：

Fujiwara, T ^{[1
]}

Nakaue, T ^{[1
]}

Yoshimura, M ^{[1
]}

机构：

[1] Tokyo Inst Technol, Mat & Struct Lab, Midori Ku, Yokohama, Kanagawa 2268503, Japan

来源：

SOLID STATE IONICS | 2004年 / 175卷 / 1-4期

关键词：

direct patterning; soft solution process; Cu2O; thin film; electrodeposition;

D O I：

10.1016/j.ssi.2004.01.081

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

We have developed a direct patterning method to form Cu2O patterns onto substrates by an electrodeposition method with a glass capillary tube, including an electrolyte containing CuSO4 and chelating agent. Cu2O pattern on the titanium substrates was successfully fabricated at 60 degreesC. Furthermore, we found that the chelating agent, which has -CH(OH)COOH group, was effective to form crystalline Cu-2 patterns. (C) 2004 Elsevier B.V. All rights reserved.

引用

页码：541 / 544

页数：4

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