Etching of porous silicon in basic solution

被引:10
作者
Hamm, D [1 ]
Sakka, T [1 ]
Ogata, YH [1 ]
机构
[1] Kyoto Univ, Inst Adv Energy, Uji, Kyoto 6110011, Japan
来源
PHYSICA STATUS SOLIDI A-APPLIED RESEARCH | 2003年 / 197卷 / 01期
关键词
D O I
10.1002/pssa.200306495
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This study reveals that a silicon sample with a porous layer immersed in strong basic solution is etched in several steps according to the surface area of the various materials to be dissolved (nano/macroporous or bulk silicon). As a result it demonstrates the possibility to produce various silicon surface morphologies. These morphologies range from macropore structure to inverted pyramids with crystalline facets. The technique used was the immersion of porous silicon in basic solution and the parameters varied were the immersion time and the concentration of the solution. This is a simple and interesting method to produce a desired morphology of silicon. Furthermore, this work shows the limit of the porosity determination by the weight measurement method.
引用
收藏
页码:175 / 179
页数:5
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