A technique is described for assembly of multiple batches of micro components onto a single substrate. The substrate is prepared with hydrophobic alkanethiol-coated gold binding sites. To perform assembly, a hydrocarbon oil, which is applied to the substrate, wets exclusively the hydrophobic binding sites in water. Micro components are then added to the water, and assembled on the oil-wetted binding sites. Moreover, assembly can be controlled to take place on desired binding sites by using an electrochemical method to deactivate specific substrate binding sites. By repeatedly applying this technique, different batches of micro components can be sequentially assembled to a single substrate. As a post assembly procedure, electroplating is incorporated into the technique to establish electrical connections for assembled components. Important issues presented are: substrate fabrication techniques, electrochemical modulation by using a suitable alkanethiol (dodecanethiol), electroplating of tin and lead alloy and binding site design simulations. Finally, we demonstrate a two-batch assembly of silicon square parts, and establishing electrical connectivity for assembled surface-mount light emitting diodes (LEDs) by electroplating.
