Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic

被引：57

作者：

Shoji, S ^{[1
]}

Kikuchi, H ^{[1
]}

Torigoe, H ^{[1
]}

机构：

[1] Waseda Univ, Dept Elect Informat & Commun Engn, Shinjuku Ku, Tokyo 169, Japan

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1998年 / 64卷 / 01期

关键词：

anodic bonding; low-temperature bonding; micro assembly; micro package; glass ceramic;

D O I：

10.1016/S0924-4247(97)01659-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silicon-to-glass anodic bonding is performed at temperatures below 180 degrees C using lithium aluminosilicate-beta-quartz glass ceramic. High alkaline ion mobility at low temperature, which is required for bonding, and thermal expansion coefficient matching to Si are realized by controlling the composition of the glass ceramic. Bonding is obtained at a lowest temperature of 140 degrees C. Useful bonding conditions are temperature above 160 degrees C (applied voltage above 500 V). Since the etch rate of the glass ceramic is five times higher than that of Pyrex glass in HF wet etching and the undercut is very small with a Cr-Au etch mask, three-dimensional structures are easily fabricated, Low-temperature anodic bonding using this type of glass ceramic is useful for the packaging and assembling of MEMS. (C) 1998 Elsevier Science S.A.

引用

页码：95 / 100

页数：6

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