Dehydration after plasma oxidation of porous low-dielectric-constant spin-on-glass films

被引：23

作者：

Kondoh, E ^{[1
]}

Asano, T

Arao, H

Nakashima, A

Komatsu, M

机构：

[1] Kyushu Inst Technol, Ctr Microelect Syst, Iizuka, Fukuoka 8208502, Japan

[2] Catalysis & Chem Ind Co Ltd, Fine Chem Res Ctr, Kitakyushu, Fukuoka 8080027, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2000年 / 39卷 / 7A期

关键词：

low-dielectric-constant material; spin-on-glass; plasma; HMDS;

D O I：

10.1143/JJAP.39.3919

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

In this paper, the dehydration behavior of hydrogen-methyl-siloxane-based porous spin-on-glass (SOG) films after oxygen plasma exposure is reported. The resultant loss of hydrophohic groups from the plasma exposure makes the films hygroscopic and thus the film dielectric constant can significantly increase. We employed a simple method consisting of spin-on coating of hexadimethyldisilazane (HMDS) with successive hotplate baking so as to dehydrate the films and decrease the film dielectric constant.

引用

页码：3919 / 3923

页数：5