Electrical characterization and material evaluation of zirconium oxynitride gate dielectric in TaN-gated NMOSFETs with high temperature forming gas annealing

被引:52
作者
Nieh, RE [1 ]
Kang, CS [1 ]
Cho, HJ [1 ]
Onishi, K [1 ]
Choi, R [1 ]
Krishnan, S [1 ]
Han, JH [1 ]
Kim, YH [1 ]
Akbar, MS [1 ]
Lee, JC [1 ]
机构
[1] Univ Texas, Microelect Res Ctr, Austin, TX 78758 USA
关键词
gate dielectric; high-k; mobility; zirconium oxide; zirconium oxynitride (Zr-oxynitride);
D O I
10.1109/TED.2002.808531
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The electrical, material, and reliability characteristics of zirconium oxynitride,(Zr-oxynitride) gate dielectrics were evaluated. The nitrogen (similar to1.7%) in Zr-oxynitride was primarily located at the Zr-oxynitride/Si interface and helped to preserve the composition of the nitrogen-doped Zr-silicate interfacial layer (IL) during annealing as compared to the ZrO2 IL-resulting in improved thermal stability of the Zr-oxynitride. In addition, the Zr-oxynitride demonstrated a higher crystallization temperature (similar to600 degreesC) as compared to ZrO2 (similar to400 degreesC). Reliability characterization was performed after TaN-gated nMOSFET fabrication of Zr-oxynitride and ZrO2 devices with equivalent oxide thickness (EOTs) of 10.3 Angstrom and 13.8 Angstrom, respectively. Time-zero dielectric breakdown and time-dependent dielectric breakdown (TDDB) characteristics revealed higher dielectric strength and effective breakdown field for the Zr-oxynitride. High-temperature forming gas (HTFG) annealing on TaN/Zr-oxynitride nMOSFETs with an EOT of 11.6 Angstrom demonstrated reduced D-it, which resulted in, reduced swing (69 mV/decade), reduced off-state leakage current, higher transconductance, and-higher mobility. The peak mobility was increased by almost fourfold from 97 cm V(.)s to 383 cm(2) V(.)s after 600 degreesC HTFG annealing.
引用
收藏
页码:333 / 340
页数:8
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