High-speed electrical signaling: Overview and limitations

被引：113

作者：

Horowitz, M ^{[1
]}

Yang, CKK ^{[1
]}

Sidiropoulos, S ^{[1
]}

机构：

[1] Stanford Univ, Stanford, CA 94305 USA

来源：

IEEE MICRO | 1998年 / 18卷 / 01期

关键词：

D O I：

10.1109/40.653013

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

As IC speeds and integration levels increase with advances in fabrication technology, so must off-chip data bandwidth. Although this goal is challenging, circuit design techniques will enable bandwidth to scale.

引用

页码：12 / 24

页数：13

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