Optimization of DUV chemically amplified resist platforms for SCALPEL E-beam exposure

被引:5
作者
Ocola, LE [1 ]
Blakey, MI [1 ]
Orphanos, PA [1 ]
Li, WY [1 ]
Novembre, AE [1 ]
Brainard, RL [1 ]
Mackevich, JF [1 ]
Taylor, GN [1 ]
机构
[1] Bell Labs, Lucent Technol, Murray Hill, NJ 07974 USA
来源
EMERGING LITHOGRAPHIC TECHNOLOGIES IV | 2000年 / 3997卷
关键词
SCALPEL; resists; chemically amplified; Monte Carlo; simulation; DUV;
D O I
10.1117/12.390055
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Optimization of phenolic chemically amplified resist platforms has lead to the development of new resists, capable of high throughput SCALPEL exposure. A positive resist, XP9947A, has exhibited 100 nm and 80 nm dense line resolution with good sensitivity and dose latitude. The influence of DUV absorption and 100 KV e-beam absorption to the optimization process is discussed. The nature of 100 KV e-beam absorption enables a greater freedom of resist design than encountered for DW resists.
引用
收藏
页码:194 / 203
页数:10
相关论文
共 6 条
[1]  
Ocola L E, 1996, THESIS U WISCONSIN
[2]   PARAMETRIC MODELING OF PHOTOELECTRON EFFECTS IN X-RAY-LITHOGRAPHY [J].
OCOLA, LE ;
CERRINA, F .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1993, 11 (06) :2839-2844
[3]   PARAMETRIC MODELING AT RESIST-SUBSTRATE INTERFACES [J].
OCOLA, LE ;
CERRINA, F .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (06) :3986-3989
[4]   Lithography for sub-60 nm resist nanostructures [J].
Ocola, LE ;
Tennant, D ;
Timp, G ;
Novembre, A .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1999, 17 (06) :3164-3167
[5]  
OCOLA LE, 1999, MNE 99 P ROM
[6]   Resist processes for hybrid (electron-beam deep ultraviolet) lithography [J].
Tedesco, S ;
Mourier, T ;
Dal'zotto, B ;
McDougall, A ;
Blanc-Coquant, S ;
Quéré, Y ;
Paniez, PJ ;
Mortini, B .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (06) :3676-3683