Thermoreflectance measurements of transient temperature upon integrated circuits: application to thermal conductivity identification

被引：12

作者：

Phan, T

Dilhaire, S

Quintard, V

Claeys, W

Batsale, JC

机构：

[1] Univ Bordeaux 1, Lab Caracterisat Opt CPMOH, F-33405 Talence, France

[2] CNRS, F-33405 Talence, France

[3] ENSAM, Lab Energet & Phenomenes Transfert LEPT, F-33405 Talence, France

[4] CNRS, F-33405 Talence, France

来源：

MICROELECTRONICS JOURNAL | 1998年 / 29卷 / 4-5期

关键词：

D O I：

10.1016/S0026-2692(97)00056-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An analytical 2D study, based on the method of integral transform, for transient heat transfer in a multilayered structure, and an optical technique for transient temperature measurement have been developed. Their application to the case of Joule heating of micrometric interconnections on submicron insulation layers permits one to identify thermophysical properties of the materials involved. (C) 1998 Published by Elsevier Science Ltd. All rights reserved.

引用

页码：181 / 190

页数：10

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