Impurity incorporation mechanism in step-controlled epitaxy growth temperature and substrate off-angle dependence

被引:55
作者
Yamamoto, T [1 ]
Kimoto, T [1 ]
Matsunami, H [1 ]
机构
[1] Kyoto Univ, Dept Elect Sci & Engn, Kyoto 60601, Japan
来源
SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2 | 1998年 / 264-2卷
关键词
step-controlled epitaxy; impurity incorporation; growth temperature; off-angle; C/Si ratio; surface polarity; thermal desorption; (11(2)over-bar-0) substrate; SIMS depth profile;
D O I
10.4028/www.scientific.net/MSF.264-268.111
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
For precise control of impurity incorporation into SiC epilayers, we made clear how impurities incorporate in grown layers, by changing several epitaxial growth parameters : C/Si ratio, substrate surface polarity, growth temperature and substrate off-angle. Impurity incorporation strongly depends on growth temperature, which is caused by a thermal desorption process. The site replaced by an impurity, surface polarity, off-angle are related each other, and they severely influence impurity incorporation. On a (<11(2)over bar 0>) substrate, the C/Si ratio dependence of impurity incorporation is between the cases on Si-and C-faces.
引用
收藏
页码:111 / 114
页数:4
相关论文
共 7 条
[1]  
ITOH A, 1994, APPL PHYS LETT, V65
[2]  
KIMOTO T, 1997, J APPL PHYS, V81
[3]  
KIMOTO T, 1995, APPL PHYS LETT, V67
[4]  
KORDINA O, 1995, APPL PHYS LETT, V66
[5]  
Kuroda N., 1987, 19 C SOL STAT DEV MA, P227
[6]  
Larkin DJ, 1996, INST PHYS CONF SER, V142, P23
[7]   Silicon carbide high-power devices [J].
Weitzel, CE ;
Palmour, JW ;
Carter, CH ;
Moore, K ;
Nordquist, KJ ;
Allen, S ;
Thero, C ;
Bhatnagar, M .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1996, 43 (10) :1732-1741