Silicon carbide high-power devices

被引:364
作者
Weitzel, CE [1 ]
Palmour, JW [1 ]
Carter, CH [1 ]
Moore, K [1 ]
Nordquist, KJ [1 ]
Allen, S [1 ]
Thero, C [1 ]
Bhatnagar, M [1 ]
机构
[1] CREE RES,DURHAM,NC 27713
基金
美国国家航空航天局;
关键词
D O I
10.1109/16.536819
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In recent gears, silicon carbide has received increased attention because of its potential for high-power devices. The unique material properties of SiC, high electric breakdown field, high saturated electron drift velocity, and high thermal conductivity are what give this material its tremendous potential in the power device arena. 4H-SiC Schottky barrier diodes (1400 V) with forward current densities over 700 A/cm(2) at 2 V have been demonstrated. Packaged SIT's have produced 57 W of output power at 500 MHz. SiC UMOSFET's (1200 V) are projected to have 15 times the current density of Si IGBT's (1200 V). Submicron gate length 4H-SiC MESFET's have achieved f(max) = 32 GHz, f(T) = 14.0 GHz, and power density = 2.8 W/mm @ 1.8 GHz. The performance of a wide variety of SiC devices will be compared to that of similar Si and GaAs devices and to theoretically expected results.
引用
收藏
页码:1732 / 1741
页数:10
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