Degradation of the Au4Al compound in gold ballbonds during isothermal aging in air at 175 °C

被引：15

作者：

Breach, CD ^{[1
]}

Tok, CW ^{[1
]}

Wulff, F ^{[1
]}

Calpito, D ^{[1
]}

机构：

[1] Kulicke & Soffa SEA Pte Ltd, Mat & Applicat Ctr, Singapore 569871, Singapore

来源：

JOURNAL OF MATERIALS SCIENCE | 2004年 / 39卷 / 19期

关键词：

D O I：

10.1023/B:JMSC.0000041716.58658.0a

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The degradation of the Au 4Al compound in gold ballbonds during isothermal aging in air at 175 °C was investigated. The effects of the intermetallic compound growth in high temperature on the mechanical reliability of wire-bonded packages were also studied. Pull and shear tests were performed on the gold ballbonds. It was observed that chemical degradation of the Au 4Al compound might occur due to oxidative degradation at high temperature. Role of bondpad contaminants, which can act as catalysts, in the degradation process was also discussed.

引用

页码：6125 / 6128

页数：4

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