Automated assembly of flip-up micromirrors

Batch fabrication of microelectromechanical systems utilizing flip-up microstructures is limited by the manual assembly process required to lift the structures off the substrate. This problem is solved with the use of an automated assembly system integrated on the die with the flip-up structures. A microelectromechanical automated assembly system consisting of a vertical thermal actuator, a linear assembly micromotor, and a self-engaging locking mechanism is presented in this paper. The vertical thermal actuator is used to lift one end of the plate off the substrate. This provides the linear assembly micromotor with the leverage needed to push the plate up into a position where the self-engaging locking mechanism secures the plate. A CMOS drive system has been developed to control the automated assembly system. When combined with the automated assembly system, CMOS control allows flip-up microstructures to be assembled without any operator intervention. The automated assembly system is demonstrated with a scanning micromirror and a corner cube reflector. (C) 1998 Elsevier Science S.A. All rights reserved.