SOP integration and codesign of antennas

被引:30
作者
Brebels, S [1 ]
Ryckaert, J [1 ]
Côme, B [1 ]
Donnay, S [1 ]
De Raedt, W [1 ]
Beyne, E [1 ]
Mertens, RP [1 ]
机构
[1] IMEC, MCP, EDAS, B-3001 Louvain, Belgium
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2004年 / 27卷 / 02期
关键词
antennas; codesign; integration; system-on-package (SOP);
D O I
10.1109/TADVP.2004.828822
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The successful deployment of wireless systems requires the integration of small, cost-effective antennas while preserving a reasonable electrical performance in the required bandwidth. This paper begins with a short overview of the most important antenna characteristics, and then uses these to describe the minimum requirements and fundamental performance-size limits for electrically small integrated antennas. The performance-size tradeoff is further illustrated by the design of a planar integrated antenna for WLAN. Codesign guidelines are given to avoid parasitic coupling between the integrated antenna and RF circuits. A concluding comparison is made between on-chip and on-package integration of a small antenna for microwave and millimeter wave systems.
引用
收藏
页码:341 / 351
页数:11
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