MICROFABRICATED THERMAL ABSOLUTE-PRESSURE SENSOR WITH ON-CHIP DIGITAL FRONT-END PROCESSOR

被引：89

作者：

MASTRANGELO, CH

MULLER, RS

机构：

[1] UNIV CALIF BERKELEY,DEPT ELECT ENGN & COMP SCI,BERKELEY SENSOR & ACTUATOR CTR,BERKELEY,CA 94720

[2] UNIV CALIF BERKELEY,ELECTR RES LAB,BERKELEY,CA 94720

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1991年 / 26卷 / 12期

关键词：

D O I：

10.1109/4.104194

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A thermal absolute-pressure sensor of the heated microbridge type has been integrated with an active bias circuit and an 8-b successive-approximation register A/D converter. The chip, which contains about 1000 devices, is sensitive to variations in absolute gas pressure between 10 and 10(4) Pa, and it is implemented in a 4-mu-m NMOS technology merged with the microsensor process. The output of the chip is a robust digital signal adequate for transmission in high-noise environments.

引用

页码：1998 / 2007

页数：10