QUANTITATIVE INTERDIFFUSION STUDIES OF NOBLE METAL/SI(111)-7X7 INTERFACES BY ANGLE-RESOLVED AUGER-ELECTRON EMISSION

被引：5

作者：

CHAMBERS, SA

GREENLEE, TR

HOWELL, GA

WEAVER, JH

机构：

[1] BETHEL COLL,DEPT PHYS,ST PAUL,MN 55112

[2] UNIV MINNESOTA,DEPT CHEM ENGN & MAT SCI,MINNEAPOLIS,MN 55455

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 03期

关键词：

D O I：

10.1116/1.573045

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：1291 / 1294

页数：4

共 8 条

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[7] FORMATION AND PROPERTIES OF THE COPPER SILICON (111) INTERFACE
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