STRESS-INDUCED DEFORMATION OF ALUMINUM METALLIZATION IN PLASTIC MOLDED SEMICONDUCTOR-DEVICES

被引：38

作者：

THOMAS, RE

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1985年 / 8卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1985.1136541

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：427 / 434

页数：8

共 14 条

DALE, JR ;

OLDFIELD, RC .

MICROELECTRONICS AND RELIABILITY, 1977, 16 (03) :255-258

[2]

Inayoshi H., 1979, 17th Annual Proceedings Reliability Physics, P113, DOI 10.1109/IRPS.1979.362879

[3]

Isagawa M., 1980, 18th Annual Proceedings of Reliability Physics, P171, DOI 10.1109/IRPS.1980.362935

[4]

JORDAN RB, 1981, 31ST P EL COMP C, P130

[5]

KAKIE M, 1984, NIKKEI ELECTRONIC MI, P82

[6]

MIYAKE K, 1984, IECE P JAPAN, P2833

[7]

OKIKAWA S, 1983, OCT INT SOC TEST FAI

[8]

Sasaki S., 1984, 34th Electronic Components Conference, P383

[9]

SCHROEN WH, 1981, 19TH ANN P REL PHYS, P1

[10]

SHINOHARA M, 1982, PLASTICS TELECOMMUNI, V3