Demonstration of three-dimensional microstructure self-assembly

被引：83

作者：

Green, PW

Syms, RRA

Yeatman, EM

机构：

[1] Optical and Semiconductor Devices Section, Department of Electrical and Electronic Engineering, Imperial College of Science, Technology and Medicine, London

来源：

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 1995年 / 4卷 / 04期

基金：

英国工程与自然科学研究理事会;

关键词：

D O I：

10.1109/84.475543

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Abstract-Self-assembly of three-dimensional microstructures using the surface tension force of molten solder to produce out-of-plane rotation is demonstrated. The generic nature of the technique is illustrated by reconfiguring structures formed in both Ni metal and single crystal Si, The structures do not have a hinge to constrain the rotation. This considerably simplifies fabrication and eliminates problems associated with the compatibility of a suitable hinge material. Details of the fabrication processes are given and results are presented for rotated structures. [139]

引用

页码：170 / 176

页数：7

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