MORPHOLOGY AND PROPERTIES OF SPUTTERED TIN LAYERS AS A FUNCTION OF SUBSTRATE-TEMPERATURE AND SPUTTERING PRESSURE

被引:10
作者
KOPACZ, U
JEHN, HA
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D O I
10.1016/0040-6090(85)90320-7
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T [工业技术];
学科分类号
08 ;
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页码:265 / 273
页数:9
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共 16 条
[1]   ULTRAMICROHARDNESS TESTER FOR USE IN A SCANNING ELECTRON-MICROSCOPE [J].
BANGERT, H ;
WAGENDRISTEL, A ;
ASCHINGER, H .
COLLOID AND POLYMER SCIENCE, 1981, 259 (02) :238-240
[2]  
CHEVALLIER J, 1980, B CERCLE ETUDE MET, V14
[3]  
GRANIER J, 1977, 9TH PLANS SEM REUTT
[4]  
HABIG KH, 1984, VDI BER VER DTSCH IN, V506, P87
[5]   THE MICROSTRUCTURE OF REACTIVELY SPUTTERED TI-N FILMS [J].
HIBBS, MK ;
SUNDGREN, JE ;
JACOBSON, BE ;
JOHANSSON, BO .
THIN SOLID FILMS, 1983, 107 (02) :149-157
[6]   MICROSTRUCTURES OF TIN AND TI2N DEPOSITS PREPARED BY ACTIVATED REACTIVE EVAPORATION [J].
JACOBSON, BE ;
NIMMAGADDA, R ;
BUNSHAH, RF .
THIN SOLID FILMS, 1979, 63 (02) :333-339
[7]  
JEHN H, 1984, Z METALLKD, V75, P862
[8]   INFLUENCE OF SUBSTRATE SHAPE ON TIN FILMS PREPARED BY REACTIVE SPUTTERING [J].
JOHANSSON, BO ;
SUNDGREN, JE ;
HENTZELL, HTG ;
KARLSSON, SE .
THIN SOLID FILMS, 1984, 111 (04) :313-322
[9]  
MOVCHAN BA, 1969, PHYS METALS METALLOG, V28, P83
[10]  
MUNZ WD, 1981, WERKST VEREDEL, V3, P108