ELECTRICAL-RESISTIVITY, TCR AND THERMOELECTRIC-POWER OF ANNEALED THIN COPPER-FILMS

被引：48

作者：

RAO, VVRN ^{[1
]}

MOHAN, S ^{[1
]}

REDDY, PJ ^{[1
]}

机构：

[1] SRI VENKATESWARA UNIV,DEPT PHYS,TIRUPATI 517 502,INDIA

来源：

JOURNAL OF PHYSICS D-APPLIED PHYSICS | 1976年 / 9卷 / 01期

关键词：

D O I：

10.1088/0022-3727/9/1/015

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：89 / 94

页数：6

共 15 条

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[7]

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[9] THERMOELECTRIC-POWER OF THIN COPPER-FILMS [J].

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[10] TEMPERATURE COEFFICIENT OF RESISTANCE OF ANNEALED AND AGGLOMERATED SILVER FILMS [J].

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