MINIMIZING PROCESS-INDUCED SLIP IN SILICON WAFERS BY SLOW HEATING AND COOLING

[1] COPPER PRECIPITATION ON DISLOCATIONS IN SILICON [J]. JOURNAL OF APPLIED PHYSICS, 1956, 27 (10) : 1193 - 1195

[2] HEARN EW, 1974, J ELECTROCHEM SOC, V121, pC208

[3] Hillman G., 1974, Solid State Technology, V17, P68

[4] TEMPERATURE DISTRIBUTION AND STRESSES IN CIRCULAR WAFERS IN A ROW DURING RADIATIVE COOLING [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (11) : 4413 - +

[5] DISLOCATIONS IN THERMALLY STRESSED SILICON WAFERS [J]. APPLIED PHYSICS LETTERS, 1973, 22 (05) : 261 - 264

[6] THERMAL STRESS AND PLASTIC DEFORMATION OF THIN SILICON SLICES [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (10) : 4104 - &

[7] THERMAL CONDITIONS WHEN DISLOCATIONS ARE GENERATED IN SILICON [J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (04) : 1477 - &

[8] SILICON MATERIAL PROBLEMS IN SEMICONDUCTOR DEVICE TECHMOLOGY [J]. MICROELECTRONICS RELIABILITY, 1970, 9 (05) : 397 - &

[9] SCHWUTTKE GH, 1971, 8TH ANN P REL PHYS, P274

[10] VARKER CJ, 1974, J ELECTROCHEM SOC, V121, pC376

[1] COPPER PRECIPITATION ON DISLOCATIONS IN SILICON [J]. JOURNAL OF APPLIED PHYSICS, 1956, 27 (10) : 1193 - 1195

[2] HEARN EW, 1974, J ELECTROCHEM SOC, V121, pC208

[3] Hillman G., 1974, Solid State Technology, V17, P68

[4] TEMPERATURE DISTRIBUTION AND STRESSES IN CIRCULAR WAFERS IN A ROW DURING RADIATIVE COOLING [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (11) : 4413 - +

[5] DISLOCATIONS IN THERMALLY STRESSED SILICON WAFERS [J]. APPLIED PHYSICS LETTERS, 1973, 22 (05) : 261 - 264

[6] THERMAL STRESS AND PLASTIC DEFORMATION OF THIN SILICON SLICES [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (10) : 4104 - &

[7] THERMAL CONDITIONS WHEN DISLOCATIONS ARE GENERATED IN SILICON [J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (04) : 1477 - &

[8] SILICON MATERIAL PROBLEMS IN SEMICONDUCTOR DEVICE TECHMOLOGY [J]. MICROELECTRONICS RELIABILITY, 1970, 9 (05) : 397 - &

[9] SCHWUTTKE GH, 1971, 8TH ANN P REL PHYS, P274

[10] VARKER CJ, 1974, J ELECTROCHEM SOC, V121, pC376