CW MEASUREMENT OF HBT THERMAL-RESISTANCE

被引:130
作者
DAWSON, DE
GUPTA, AK
SALIB, ML
机构
[1] Westinghouse Electric Corporation, Baltimore, MD, 21203
关键词
D O I
10.1109/16.158793
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Measurements of the temperature dependence of beta and V(BE) were made on AlGaAs/GaAs HBT's and used to determine device thermal resistance. The measurements were CW and not switched or pulsed in order to have a simpler procedure. With base doping greater than 10(19) cm-3 HBT's have negligible base-width modulation (i.e., flat I(C) versus V(CE) characteristics) which makes CW thermal resistance measurement especially direct and simple.
引用
收藏
页码:2235 / 2239
页数:5
相关论文
共 6 条
[1]   EXPERIMENTS ON HEAT SINKING OF SEMICONDUCTOR DEVICES [J].
FALLMANN, W ;
HARTNAGEL, HL ;
MATHUR, PC .
ELECTRONICS LETTERS, 1971, 7 (18) :512-+
[2]   EMITTER BALLASTING RESISTOR DESIGN FOR, AND CURRENT HANDLING CAPABILITY OF ALGAAS/GAAS POWER HETEROJUNCTION BIPOLAR-TRANSISTORS [J].
GAO, G ;
UNLU, MS ;
MORKOC, H ;
BLACKBURN, DL .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (02) :185-196
[3]   THERMAL RESISTANCE OF HEAT SINKS WITH TEMPERATURE-DEPENDENT CONDUCTIVITY [J].
JOYCE, WB .
SOLID-STATE ELECTRONICS, 1975, 18 (04) :321-322
[4]   THERMAL CHARACTERIZATION OF POWER TRANSISTORS [J].
OETTINGER, FF ;
BLACKBURN, DL ;
RUBIN, S .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1976, 23 (08) :831-838
[5]  
SMITH DH, 1986, DEC IEEE SEMITHERM 8
[6]  
SPARKES JJ, 1958, P IRE, V46, P1305