INTERACTION OF TI WITH FUSED-SILICA AND SAPPHIRE DURING METALLIZATION

被引:28
作者
CHAUG, YS
CHOU, NJ
KIM, YH
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1987年 / 5卷 / 04期
关键词
D O I
10.1116/1.574792
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
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页码:1288 / 1291
页数:4
相关论文
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