共 2 条
[1]
MECHANISM OF SILICON ETCHING BY A CF4 PLASMA
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY,
1978, 15 (05)
:1734-1738
[2]
REACTIVE ION ETCHING OF ALUMINUM AND ALUMINUM-ALLOYS IN AN RF PLASMA CONTAINING HALOGEN SPECIES
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY,
1978, 15 (02)
:334-337