MICROSTRUCTURE EVOLUTION DURING ELECTROLESS COPPER DEPOSITION

被引：55

作者：

KIM, J ^{[1
]}

WEN, SH ^{[1
]}

JUNG, DY ^{[1
]}

JOHNSON, RW ^{[1
]}

机构：

[1] IBM CORP,DIV GEN TECHNOL,ENDICOTT,NY 13760

来源：

关键词：

D O I：

10.1147/rd.286.0697

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：697 / 710

页数：14

共 22 条

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