BONDING CHARACTERISTICS OF GOLD IN ULTRAHIGH-VACUUM

被引：12

作者：

CUTHRELL, RE ^{[1
]}

TIPPING, DW ^{[1
]}

机构：

[1] SANDIA LABS,ALBUQUERQUE,NM 87115

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1974年 / PH10卷 / 01期

关键词：

D O I：

10.1109/TPHP.1974.1134828

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：4 / 10

页数：7

共 18 条

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[7]

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[8] ELECTRIC CONTACTS .2. MECHANICS OF CLOSURE FOR GOLD CONTACTS [J].

CUTHRELL, RE ;

TIPPING, DW .

JOURNAL OF APPLIED PHYSICS, 1973, 44 (10) :4360-4365

[9] ELECTRIC CONTACTS .1. APPLICATION OF INTERFERENCE FRINGE MICROSCOPY TO ELECTRIC CONTACT PROBLEMS [J].

CUTHRELL, RE ;

TIPPING, DW .

JOURNAL OF APPLIED PHYSICS, 1973, 44 (07) :3277-3283

[10]

CUTHRELL RE, 1972, SCRR720783 SAND LAB

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