STRESS-RELAXATION BEHAVIOR OF EUTECTIC TIN-LEAD SOLDER

被引：27

作者：

HARE, EW ^{[1
]}

STANG, RG ^{[1
]}

机构：

[1] UNIV WASHINGTON, DEPT MAT SCI & ENGN, SEATTLE, WA 98195 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1995年 / 24卷 / 10期

关键词：

CREEP; EUTECTIC TIN-LEAD; SOLDER; STRESS RELAXATION;

D O I：

10.1007/BF02655466

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The creep behavior of eutectic tin-lead solder was investigated using stress relaxation techniques. Stress relaxation experiments were performed on cast tensile specimens of commercial eutectic tin-lead solder, SN63. The sample casting conditions were controlled to produce microstructures similar to those found in typical solder joints on electronic assemblies. The stress relaxation data was analyzed to extract constitutive relations for creep. The strain rate during relaxation was found to follow two power law expressions, one with n = 3.2 at low stress levels and the other with n = 6.2 at higher stress levels. The apparent activation energy for creep and the power law exponent are discussed with relation to the published data for this alloy.

引用

页码：1473 / 1484

页数：12

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