BIBLIOGRAPHY OF HEAT-TRANSFER IN ELECTRONIC EQUIPMENT

[31] THE EFFECT OF MAGNETIC PACKAGE LEADS ON THE MEASUREMENT OF THERMAL-RESISTANCE OF SEMICONDUCTOR-DEVICES [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1981, 28 (05) : 609 - 611

[32] BIRNBREIER H, 1981, ASME HTD, V20, P19

[33] BISKEBORN R, 1984, 4TH ANN INT EL PACK, P468

[34] BLACKBURN DL, 1982, JUN IEEE POW EL SPEC, P400

[35] BLACKBURN EC, 1984, SOLID STATE TECH JAN, P113

[36] BOARD K, 1975, ELECTRONICS JAN, P124

[37] BOHN J, 1981, ELECTRONIC PACKA SEP, P92

[38] BRAATEN ME, 1984, ASME HTD, V32, P77

[39] BUCHANAN RC, 1973, SOLID STATE TECH FEB, P39

[40] THERMAL TRANSIENTS IN ELECTRONIC PACKAGES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (04): : 588 - 594

[31] THE EFFECT OF MAGNETIC PACKAGE LEADS ON THE MEASUREMENT OF THERMAL-RESISTANCE OF SEMICONDUCTOR-DEVICES [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1981, 28 (05) : 609 - 611

[32] BIRNBREIER H, 1981, ASME HTD, V20, P19

[33] BISKEBORN R, 1984, 4TH ANN INT EL PACK, P468

[34] BLACKBURN DL, 1982, JUN IEEE POW EL SPEC, P400

[35] BLACKBURN EC, 1984, SOLID STATE TECH JAN, P113

[36] BOARD K, 1975, ELECTRONICS JAN, P124

[37] BOHN J, 1981, ELECTRONIC PACKA SEP, P92

[38] BRAATEN ME, 1984, ASME HTD, V32, P77

[39] BUCHANAN RC, 1973, SOLID STATE TECH FEB, P39

[40] THERMAL TRANSIENTS IN ELECTRONIC PACKAGES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (04): : 588 - 594