SILICON-WAFER FABRICATION AND (POTENTIAL) APPLICATIONS OF DIRECT-BONDED SILICON

被引：3

作者：

HAISMA, J

MICHIELSEN, TM

VANDERKRUIS, FJHM

机构：

[1] Philips Research Laboratories, 5656 AA Eindhoven

来源：

PHILIPS JOURNAL OF RESEARCH | 1995年 / 49卷 / 1-2期

关键词：

DIRECT BONDING APPARATUS; SUPER PARALLEL POLISHING; MEASUREMENT OF PARALLELISM; SILICON ON SILICON; SILICON ON INSULATOR; SILICON ON METAL; SILICON ON INTERDIFFUSING SOLIDS; SILICON ON SUPERCONDUCTOR; SILICON ON DIAMOND; SILICON ON FERROELECTRIC; SILICON ON POLYMER;

D O I：

10.1016/0165-5817(95)82004-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

An automatic silicon wafer direct-bonding apparatus, a vacuum stack-bonding apparatus, a parallel polishing machine and a method for measuring a high level of parallelism of silicon wafers are described. These items are essential to wafer preparation and geometrical quality control for direct-bonding applications. Attention is then turned to silicon direct-bonded to a second compound, which presents a wealth of feasible or potential applications, such as silicon-on-silicon for a permeable-base transistor; silicon-on-insulator, prepared for special silicon integrated circuit applications. In addition, silicon bonded to metal, to interdiffusing solids, to superconductors, diamond, a ferroelectric and to polymers for various (potential) applications is discussed.

引用

页码：65 / 89

页数：25

共 10 条

[1]

DESAMBER MA, IN PRESS SENSORS ACT

[2] LATTICE-CONSTANT-ADAPTABLE CRYSTALLOGRAPHICS .1. HETEROEPITAXIAL GROWTH OF SEMICONDUCTORS AND OTHER SPECIFIC COMPOUNDS ON LATTICE-CONSTANT-ADAPTED GARNETS, SPINELS AND PEROVSKITES - A SYSTEMATIC GEOMETRICAL (NOT EXPERIMENTAL) EVALUATION [J].