PLATING OF COPPER INTO THROUGH-HOLES AND VIAS

被引：85

作者：

YUNG, EK ^{[1
]}

ROMANKIW, LT ^{[1
]}

ALKIRE, RC ^{[1
]}

机构：

[1] UNIV ILLINOIS,DEPT CHEM ENGN,URBANA,IL 61801

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1989年 / 136卷 / 01期

关键词：

D O I：

10.1149/1.2096587

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：206 / 215

页数：10

共 132 条

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[6]

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[7]

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[8] TENSILE PROPERTIES OF ACID COPPER ELECTRODEPOSITS [J].

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[9]

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[10]

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