FACTORS CONTRIBUTING TO CORROSION OF ALUMINUM METAL ON SEMICONDUCTOR-DEVICES PACKAGED IN PLASTICS

被引：40

作者：

OLBERG, RC ^{[1
]}

BOZARTH, JL ^{[1
]}

机构：

[1] FAIRCHILD CAMERA & INSTR CORP,RES & DEV LAB,PALO ALTO,CA 94304

来源：

MICROELECTRONICS AND RELIABILITY | 1976年 / 15卷 / 06期

关键词：

D O I：

10.1016/0026-2714(76)90278-X

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：601 / 611

页数：11

共 17 条

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[4] Flood J. L., 1972, 10 ANN P INT REL PHY, P95
[5] Khajezadeh H., 1973, Microelectronics, V5, P28
[6] KHAJEZADEH H, 1973, 11TH P ANN REL PHYS, P236
[7] Koelmans H, 1974, 12TH ANN P REL PHYS, P168
[8] INTERACTION BETWEEN PHOSPHOSILICATE GLASS-FILMS AND WATER
NAGASIMA, N
SUZUKI, H
TANAKA, K
NISHIDA, S
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1974, 121 (03) : 434 - 438
[9] EFFECTS OF EPOXY ENCAPSULANT COMPOSITION ON SEMICONDUCTOR DEVICE STABILITY
OLBERG, RC
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (01) : 129 - &
[10] OLBERG RC, 1972, J ELECTROCHEM SOC, V119, pC302