PLASMA-ETCHING OF ORGANIC MATERIALS .2. POLYIMIDE ETCHING AND PASSIVATION DOWNSTREAM OF AN O2-CF4-AR MICROWAVE PLASMA

被引：38

作者：

VUKANOVIC, V ^{[1
]}

TAKACS, GA ^{[1
]}

MATUSZAK, EA ^{[1
]}

EGITTO, FD ^{[1
]}

EMMI, F ^{[1
]}

HORWATH, RS ^{[1
]}

机构：

[1] IBM CORP,DIV SYST TECHNOL,ENDICOTT,NY 13760

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1988年 / 6卷 / 01期

关键词：

D O I：

10.1116/1.584054

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：66 / 71

页数：6

共 34 条

[1]

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[4]

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[5]

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[6]

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[7] DECAPSULATION AND PHOTORESIST STRIPPING IN OXYGEN MICROWAVE PLASMAS [J].

DZIOBA, S ;

ESTE, G ;

NAGUIB, HM .

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[8] PLASMA-ETCHING OF ORGANIC MATERIALS .1. POLYIMIDE IN O2-CF4 [J].

EGITTO, FD ;

EMMI, F ;

HORWATH, RS ;

VUKANOVIC, V .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1985, 3 (03) :893-904

[9]

EGITTO FD, 1985, 7TH P INT S PLASM CH, P983

[10]

EMMI F, 1984, 5TH P S PLASM PROC, P193

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