NONCONTACT THERMAL-WAVE IMAGING OF SUBSURFACE STRUCTURE WITH INFRARED DETECTION

被引：15

作者：

ERMERT, H

DACOL, FH

MELCHER, RL

BAUMANN, T

机构：

来源：

APPLIED PHYSICS LETTERS | 1984年 / 44卷 / 12期

关键词：

D O I：

10.1063/1.94668

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：1136 / 1138

页数：3

共 11 条

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[3] THERMAL WAVE REMOTE AND NON-DESTRUCTIVE INSPECTION OF POLYMERS [J].

BUSSE, G ;

EYERER, P .

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[4] STEREOSCOPIC DEPTH ANALYSIS BY THERMAL WAVE TRANSMISSION FOR NON-DESTRUCTIVE EVALUATION [J].

BUSSE, G ;

RENK, KF .

APPLIED PHYSICS LETTERS, 1983, 42 (04) :366-368

[5] ULTRASONIC-IMAGING IN SCANNING ELECTRON-MICROSCOPY [J].

CARGILL, GS .

NATURE, 1980, 286 (5774) :691-693

[6]

FOURNIER D, 1980, SCANNED IMAGE MICROS, P347

[7]

INGLEHART LJ, 1983, IEEE ULTRASONICS S A, P668

[8] REMOTE THERMAL IMAGING WITH 0.7-MU-M SPATIAL-RESOLUTION USING TEMPERATURE-DEPENDENT FLUORESCENT THIN-FILMS [J].

KOLODNER, P ;

TYSON, JA .

APPLIED PHYSICS LETTERS, 1983, 42 (01) :117-119

[9]

LUUKALA M, 1982, ULTRASONICS S P, V2, P591

[10] THIN-FILM THICKNESS MEASUREMENTS WITH THERMAL WAVES [J].

ROSENCWAIG, A ;

OPSAL, J ;

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APPLIED PHYSICS LETTERS, 1983, 43 (02) :166-168

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