ALIGNMENT ISSUES IN PACKAGING FOR FREE-SPACE OPTICAL INTERCONNECTS

The addition of optics to electronics in optoelectronic packaging for free-space optical interconnects alters the nature of electrical packaging design methodologies as well as the complexity of implementation. One such complexity arises from the stringent alignment requirement among the microlaser, computer-generated holographic element, and detector. The alignment achieved in the system is a function of assembly tolerance and working environment conditions such as operating temperature. The impact of these constraints on the alignability of the assembly of free-space optical interconnects is quantitatively analyzed.