OPTICAL SINGLE LAYER LIFT-OFF PROCESS

[1] A VLSI BIPOLAR METALLIZATION DESIGN WITH 3-LEVEL WIRING AND AREA ARRAY SOLDER CONNECTIONS [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (03) : 362 - 371

[2] GILLESPIE SJ, 1983, SOLID STATE TECHNOL, V26, P174

[3] HAMEL C, COMMUNICATION

[4] ELECTRON RESISTS FOR MICROCIRCUIT AND MASK PRODUCTION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1969, 116 (07) : 1033 - &

[5] SINGLE-STEP OPTICAL LIFT-OFF PROCESS [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (04) : 452 - 460

[6] LIN BJ, 1981, P MICROCIRCUIT ENG C

[7] MACDONALD SA, 1982, KODAK INTERFACE SAN

[8] Moritz H., 1978, US Patent, Patent No. 4104070

[9] MORITZ H, 1975, Patent No. 2529054

[1] A VLSI BIPOLAR METALLIZATION DESIGN WITH 3-LEVEL WIRING AND AREA ARRAY SOLDER CONNECTIONS [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (03) : 362 - 371

[2] GILLESPIE SJ, 1983, SOLID STATE TECHNOL, V26, P174

[3] HAMEL C, COMMUNICATION

[4] ELECTRON RESISTS FOR MICROCIRCUIT AND MASK PRODUCTION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1969, 116 (07) : 1033 - &

[5] SINGLE-STEP OPTICAL LIFT-OFF PROCESS [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (04) : 452 - 460

[6] LIN BJ, 1981, P MICROCIRCUIT ENG C

[7] MACDONALD SA, 1982, KODAK INTERFACE SAN

[8] Moritz H., 1978, US Patent, Patent No. 4104070

[9] MORITZ H, 1975, Patent No. 2529054