DIFFUSION-INDUCED GRAIN-BOUNDARY MIGRATION IN HEATED CU-NI ALLOY TARGETS DURING SPUTTERING

被引：10

作者：

NAKAHARA, S ^{[1
]}

DENBROEDER, FJA ^{[1
]}

机构：

[1] PHILIPS RES LABS, 5600 JA EINDHOVEN, NETHERLANDS

来源：

SCRIPTA METALLURGICA | 1983年 / 17卷 / 05期

关键词：

D O I：

10.1016/0036-9748(83)90386-1

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：607 / 610

页数：4

共 16 条

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[9] DOSE-RATE EFFECT OF THE PREFERENTIAL SPUTTERING OF COPPER-NICKEL-ALLOYS BY ARGON ION AT ELEVATED-TEMPERATURES [J].

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[10] DEPLETION OF COPPER FROM THE GRAIN-BOUNDARY REGION OF COPPER-NICKEL-ALLOYS DURING SPUTTERING AT ELEVATED-TEMPERATURES [J].

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