HIGH-INJECTION BARRIER EFFECTS IN SIGE HBTS OPERATING AT CRYOGENIC TEMPERATURES

被引:3
作者
CRESSLER, JD [1 ]
RICHEY, DM [1 ]
JAEGER, RC [1 ]
CRABBE, EF [1 ]
COMFORT, JH [1 ]
STORK, JMC [1 ]
机构
[1] IBM CORP,DIV RES,YORKTOWN HTS,NY 10598
来源
JOURNAL DE PHYSIQUE IV | 1994年 / 4卷 / C6期
关键词
D O I
10.1051/jp4:1994618
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
We demonstrate that high-injection barrier effects associated with the collector-base silicon-germanium (SiGe) to silicon (Si) heterojunction are an important design constraint for SiGe heterojunction bipolar transistors (HBTs) operating at cryogenic temperatures. Due to its thermally activated nature, these barrier effects can have important dc and ac consequences at cryogenic temperatures even when undetectable under room temperature operation. We use measured results from advanced SiGe HBTs and Si BJTs over a wide temperature range, in combination with simulation, to shed light on the design issues associated with these high-injection barrier phenomena.
引用
收藏
页码:117 / 122
页数:6
相关论文
共 13 条
[1]  
Albers J. N., 1993, Proceedings of the 23rd European Solid State Device Research Conference (ESSDERC '93), P309
[2]  
Comfort J. H., 1990, International Electron Devices Meeting 1990. Technical Digest (Cat. No.90CH2865-4), P21, DOI 10.1109/IEDM.1990.237235
[3]   VELOCITY SATURATION IN THE COLLECTOR OF SI/GEXSI1-X/SI HBTS [J].
COTTRELL, PE ;
YU, ZP .
IEEE ELECTRON DEVICE LETTERS, 1990, 11 (10) :431-433
[4]   ON THE PROFILE DESIGN AND OPTIMIZATION OF EPITAXIAL SI-BASE AND SIGE-BASE BIPOLAR TECHNOLOGY FOR 77-K APPLICATIONS .1. TRANSISTOR DC DESIGN CONSIDERATIONS [J].
CRESSLER, JD ;
COMFORT, JH ;
CRABBE, EF ;
PATTON, GL ;
STORK, JMC ;
SUN, JYC ;
MEYERSON, BS .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (03) :525-541
[5]   ON THE PROFILE DESIGN AND OPTIMIZATION OF EPITAXIAL SI-BASE AND SIGE-BASE BIPOLAR TECHNOLOGY FOR 77-K APPLICATIONS .2. CIRCUIT PERFORMANCE ISSUES [J].
CRESSLER, JD ;
CRABBE, EF ;
COMFORT, JH ;
STORK, JMC ;
SUN, JYC .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (03) :542-556
[6]  
CRESSLER JD, 1992, P EUROPEAN SOLID STA, P841
[7]   LOW-TEMPERATURE SILICON EPITAXY BY ULTRAHIGH-VACUUM CHEMICAL VAPOR-DEPOSITION [J].
MEYERSON, BS .
APPLIED PHYSICS LETTERS, 1986, 48 (12) :797-799
[8]  
Prinz E. J., 1990, International Electron Devices Meeting 1990. Technical Digest (Cat. No.90CH2865-4), P975, DOI 10.1109/IEDM.1990.237077
[9]  
RICHEY DM, 1994, IN PRESS 1ST P EUR W
[10]   CORRECTION [J].
STIFFLER, SR .
JOURNAL OF APPLIED PHYSICS, 1991, 70 (11) :7194-7194