INVESTIGATION OF SOLDER FATIGUE ACCELERATION FACTORS

被引:17
作者
FOX, LR
SOFIA, JW
SHINE, MC
机构
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1985年 / 8卷 / 02期
关键词
D O I
10.1109/TCHMT.1985.1136493
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:275 / 282
页数:8
相关论文
共 24 条
[1]   THE EFFECT OF GRAIN-SIZE ON DUCTILITY IN THE SUPERPLASTIC PB-SN EUTECTIC [J].
AHMED, MMI ;
LANGDON, TG .
JOURNAL OF MATERIALS SCIENCE LETTERS, 1983, 2 (07) :337-340
[2]  
AINSWORTH PA, 1971, METALS MATERIALS, P374
[3]  
Baker WA, 1939, J I MET, V65, P277
[4]  
BECKER G, 1979, IPCTP288 I INT PACK
[5]  
COHN GR, 1951, P ASTM, V51, P721
[6]  
DEVORE JA, 1982, NEPCON P, P409
[7]  
ECKEL JF, 1951, P AM SOC TEST MATER, V51, P745
[8]   FATIGUE LIFE OF LEADLESS CHIP CARRIER SOLDER JOINTS DURING POWER CYCLING [J].
ENGELMAIER, W .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (03) :232-237
[9]  
ENGELMAIER W, 1984, ISHM TECHNICAL MONOG, P87
[10]  
FOX LR, 1985, NEPCON W