MATERIALS ISSUES IN COPPER INTERCONNECTIONS

[1] ALLMAN B, 1993, 5TH P M DUP S HDI TH, P662

[2] ALLMAN DDJ, 1991, JUN P IEEE VLSI MULT, P373

[3] [Anonymous], 1990, BINARY ALLOY PHASE D

[4] ARCOT B, 1991, MATER RES SOC SYMP P, V225, P231, DOI 10.1557/PROC-225-231

[5] BLATT FJ, 1968, PHYSICS ELECTRONIC C

[6] BRANDRUP J, 1975, POLYM HDB, pV31

[7] TANTALUM AND CHROMIUM ADHESION TO POLYIMIDE .2. PEEL AND LOCUS OF FAILURE ANALYSES [J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1993, 7 (09) : 941 - 952

[8] BENZOCYCLOBUTENE (BCB) DIELECTRICS FOR THE FABRICATION OF HIGH-DENSITY, THIN-FILM MULTICHIP MODULES [J]. JOURNAL OF ELECTRONIC MATERIALS, 1990, 19 (12) : 1357 - 1364

[9] PREPARATION OF LOW RESISTIVITY CU-1 AT PERCENT CR THIN-FILMS BY MAGNETRON SPUTTERING [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1992, 10 (04): : 1706 - 1712

[10] REACTION BETWEEN CU AND TISI2 ACROSS DIFFERENT BARRIER LAYERS [J]. APPLIED PHYSICS LETTERS, 1990, 57 (06) : 617 - 619

[1] ALLMAN B, 1993, 5TH P M DUP S HDI TH, P662

[2] ALLMAN DDJ, 1991, JUN P IEEE VLSI MULT, P373

[3] [Anonymous], 1990, BINARY ALLOY PHASE D

[4] ARCOT B, 1991, MATER RES SOC SYMP P, V225, P231, DOI 10.1557/PROC-225-231

[5] BLATT FJ, 1968, PHYSICS ELECTRONIC C

[6] BRANDRUP J, 1975, POLYM HDB, pV31

[7] TANTALUM AND CHROMIUM ADHESION TO POLYIMIDE .2. PEEL AND LOCUS OF FAILURE ANALYSES [J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1993, 7 (09) : 941 - 952

[8] BENZOCYCLOBUTENE (BCB) DIELECTRICS FOR THE FABRICATION OF HIGH-DENSITY, THIN-FILM MULTICHIP MODULES [J]. JOURNAL OF ELECTRONIC MATERIALS, 1990, 19 (12) : 1357 - 1364

[9] PREPARATION OF LOW RESISTIVITY CU-1 AT PERCENT CR THIN-FILMS BY MAGNETRON SPUTTERING [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1992, 10 (04): : 1706 - 1712

[10] REACTION BETWEEN CU AND TISI2 ACROSS DIFFERENT BARRIER LAYERS [J]. APPLIED PHYSICS LETTERS, 1990, 57 (06) : 617 - 619