INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN

[1] OBSERVATIONS OF STRESSES IN THIN-FILMS OF PALLADIUM AND PLATINUM SILICIDES ON SILICON [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1980, 17 (01): : 471 - 475

[2] THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS [J]. JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) : 4297 - 4299

[3] Chu WK., 1978, BACKSCATTERING SPECT

[4] HARPER JE, 1982, COMMUNICATION

[5] HO PS, 1976, AIP C P, V29, P39

[6] ZRN DIFFUSION BARRIER IN ALUMINUM METALLIZATION SCHEMES [J]. THIN SOLID FILMS, 1983, 104 (1-2) : 81 - 87

[7] Kubaschewski O., 1979, METALLURGICAL THERMO

[8] NELSON CW, 1969, 1969 P INT S HYBR MI

[9] DIFFUSION BARRIERS IN THIN-FILMS [J]. THIN SOLID FILMS, 1978, 52 (03) : 415 - 443

[10] TIN AS A DIFFUSION BARRIER BETWEEN COSI2 OR PTSI AND ALUMINUM [J]. THIN SOLID FILMS, 1983, 104 (1-2) : 89 - 99

[1] OBSERVATIONS OF STRESSES IN THIN-FILMS OF PALLADIUM AND PLATINUM SILICIDES ON SILICON [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1980, 17 (01): : 471 - 475

[2] THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS [J]. JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) : 4297 - 4299

[3] Chu WK., 1978, BACKSCATTERING SPECT

[4] HARPER JE, 1982, COMMUNICATION

[5] HO PS, 1976, AIP C P, V29, P39

[6] ZRN DIFFUSION BARRIER IN ALUMINUM METALLIZATION SCHEMES [J]. THIN SOLID FILMS, 1983, 104 (1-2) : 81 - 87

[7] Kubaschewski O., 1979, METALLURGICAL THERMO

[8] NELSON CW, 1969, 1969 P INT S HYBR MI

[9] DIFFUSION BARRIERS IN THIN-FILMS [J]. THIN SOLID FILMS, 1978, 52 (03) : 415 - 443

[10] TIN AS A DIFFUSION BARRIER BETWEEN COSI2 OR PTSI AND ALUMINUM [J]. THIN SOLID FILMS, 1983, 104 (1-2) : 89 - 99