LASER-INDUCED ETCHING OF SILICON

被引:33
作者
CHOY, CH [1 ]
CHEAH, KW [1 ]
机构
[1] HONG KONG BAPTIST UNIV,DEPT PHYS,KOWLOON,HONG KONG
来源
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 1995年 / 61卷 / 01期
关键词
D O I
10.1007/BF01538209
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Conventional fabrication method of porous silicon is anodisation of single crystal silicon in hydrofluoric acid. In this report, we show that it is possible to fabricate porous silicon by laser-induced etching. An earlier report by us has demonstrated the dependence of porous silicon photoluminescence characteristic on the etching laser wavelength [1]. Here we used 780 nm line from a diode laser as the etching source, and the optimum etching conditions were obtained. A simple model was proposed to explain the etching process. Scanning Electron Microscope (SEM) images of the samples support the proposed process.
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页码:45 / 50
页数:6
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