SILICON AND SILICON DIOXIDE THERMAL BONDING FOR SILICON-ON-INSULATOR APPLICATIONS

[1] [Anonymous], 1986, WEDDING HOME AUT, P122

[2] ANTHONY TR, 85CRD078 INT REP

[3] ATALAR A, 1985, IEEE T SON ULTRASON, V32, P164, DOI 10.1109/T-SU.1985.31583

[4] FAIGON A, 1984, 1984 INT EL DEV M SA, P161

[5] GILMORE RS, 86CRD015 INT REP

[6] Iler R. K., 1979, CHEM SILICA

[7] JASTRZEBSKI L, 1984, RCA REV, V44, P250

[8] ACOUSTIC MICROSCOPY OF INTERIOR PLANES [J]. APPLIED PHYSICS LETTERS, 1979, 35 (05) : 385 - 387

[9] KERN W, 1970, RCA REV, V31, P187

[10] WAFER BONDING FOR SILICON-ON-INSULATOR TECHNOLOGIES [J]. APPLIED PHYSICS LETTERS, 1986, 48 (01) : 78 - 80

[1] [Anonymous], 1986, WEDDING HOME AUT, P122

[2] ANTHONY TR, 85CRD078 INT REP

[3] ATALAR A, 1985, IEEE T SON ULTRASON, V32, P164, DOI 10.1109/T-SU.1985.31583

[4] FAIGON A, 1984, 1984 INT EL DEV M SA, P161

[5] GILMORE RS, 86CRD015 INT REP

[6] Iler R. K., 1979, CHEM SILICA

[7] JASTRZEBSKI L, 1984, RCA REV, V44, P250

[8] ACOUSTIC MICROSCOPY OF INTERIOR PLANES [J]. APPLIED PHYSICS LETTERS, 1979, 35 (05) : 385 - 387

[9] KERN W, 1970, RCA REV, V31, P187

[10] WAFER BONDING FOR SILICON-ON-INSULATOR TECHNOLOGIES [J]. APPLIED PHYSICS LETTERS, 1986, 48 (01) : 78 - 80