WAFER BONDING FOR SILICON-ON-INSULATOR TECHNOLOGIES

被引：476

作者：

LASKY, JB

机构：

来源：

APPLIED PHYSICS LETTERS | 1986年 / 48卷 / 01期

关键词：

D O I：

10.1063/1.96768

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：78 / 80

页数：3

共 10 条

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[9]

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[10]

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