LAYER SEQUENCE AND SILICIDE FORMATION OF A CO/(REFRACTORY METAL) BILAYER ON (100)SI SUBSTRATE

被引:6
作者
BYUN, JS [1 ]
KIM, HJ [1 ]
机构
[1] SEOUL NATL UNIV, DEPT INORGAN MAT ENGN, SEOUL 151742, SOUTH KOREA
关键词
D O I
10.1063/1.360775
中图分类号
O59 [应用物理学];
学科分类号
摘要
The solid state reactions of bilayer systems, such as Co/Cr and Co/V, with a silicon substrate have been investigated. The layer sequence could be explained in terms of competitive relations between the diffusion of cobalt atoms toward the substrate and the surface reaction (i.e., silicide formation at the silicon substrate). It was also found that the intermixing between the cobalt and the refractory beneath it is related to the solid solubility between them, and the layer reversal phenomenon critically depends on the silicide formation temperature of the interlayer refractory metal. For example, in the Co/Cr bilayer, where the silicide formation temperature of the chromium is not higher than that of the cobalt, only a partial layer reversal occurs. However, in the Co/V bilayer, where vanadium has a higher silicide formation temperature than cobalt, a complete layer reversal occurs. (C) 1995 American Institute of Physics.
引用
收藏
页码:6784 / 6790
页数:7
相关论文
共 25 条
[11]   NANOSCALE COSI2 CONTACT LAYER GROWTH FROM DEPOSITED CO/TI MULTILAYERS ON SI SUBSTRATES [J].
HONG, F ;
ROZGONYI, GA ;
PATNAIK, B .
APPLIED PHYSICS LETTERS, 1992, 61 (13) :1519-1521
[12]   FORMATION OF EPITAXIAL COSI2 FILMS ON (001) SILICON USING TI-CO ALLOY AND BIMETAL SOURCE MATERIALS [J].
HSIA, SL ;
TAN, TY ;
SMITH, P ;
MCGUIRE, GE .
JOURNAL OF APPLIED PHYSICS, 1991, 70 (12) :7579-7588
[13]   RESISTANCE AND STRUCTURAL STABILITIES OF EPITAXIAL COSI2 FILMS ON (001) SI SUBSTRATES [J].
HSIA, SL ;
TAN, TY ;
SMITH, P ;
MCGUIRE, GE .
JOURNAL OF APPLIED PHYSICS, 1992, 72 (05) :1864-1873
[14]   EPITAXIAL-GROWTH OF COSI2 ON BOTH (111) SI AND (100) SI SUBSTRATES BY MULTISTEP ANNEALING OF A TERNARY CO/TI/SI SYSTEM [J].
LIU, P ;
LI, BZ ;
SUN, Z ;
GU, ZG ;
HUANG, WN ;
ZHOU, ZY ;
NI, RS ;
LIN, CL ;
ZOU, SC ;
HONG, F ;
ROZGONYI, GA .
JOURNAL OF APPLIED PHYSICS, 1993, 74 (03) :1700-1706
[15]   PROCESS LIMITATION AND DEVICE DESIGN TRADEOFFS OF SELF-ALIGNED TISI2 JUNCTION FORMATION IN SUBMICROMETER CMOS DEVICES [J].
LU, CY ;
SUNG, JMJ ;
LIU, R ;
TSAI, NS ;
SINGH, R ;
HILLENIUS, SJ ;
KIRSCH, HC .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (02) :246-254
[16]  
Massalski T. B., 1986, BINARY ALLOY PHASE D
[17]   SILICIDE FORMATION WITH PD-V ALLOYS AND BILAYERS [J].
MAYER, JW ;
LAU, SS ;
TU, KN .
JOURNAL OF APPLIED PHYSICS, 1979, 50 (09) :5855-5859
[18]  
Moulder J. F., 1992, HDB XRAY PHOTOELECTR
[19]  
MURARKA SP, 1994, MATER RES SOC SYMP P, V320, P3
[20]  
MURARKA SP, 1983, SILICIDES VLSI APPLI