ELECTROMIGRATION AND SPATIAL VARIATIONS IN METALLIC CONDUCTIVITY

被引：6

作者：

LANDAUER, R ^{[1
]}

机构：

[1] IBM CORP, THOMAS J WATSON RES CTR, YORKTOWN HTS, NY 10598 USA

来源：

关键词：

D O I：

10.1007/BF02660174

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：813 / 821

页数：9

共 19 条

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LANDAUER, R ;

WOO, JWF .

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[12]

LANDAUER R, TO BE PUBLISHED

[13]

LANDAUER RW, 1958, Patent No. 2842467

[14]

PFANN WG, 1957, J ELECTRONICS, V2, P597

[15]

PRATT JN, 1973, ELECTROTRANSPORT MET

[16]

SCHAICH WF, TO BE PUBLISHED

[17]

SHAM LJ, TO BE PUBLISHED

SORBELLO, RS .

[19]

WEVER H, 1973, ELEKTRO THERMOTRANSP