REDEPOSITION OF SPUTTERED SPECIES DURING ION ETCHING OF CU, AG, AND AU

被引：7

作者：

MILLER, AC

CZANDERNA, AW

机构：

[1] CLARKSON COLL TECHNOL,DEPT PHYS,POTSDAM,NY 13676

[2] CLARKSON COLL TECHNOL,INST COLLOID & SURFACE SCI,POTSDAM,NY 13676

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1975年 / 12卷 / 05期

关键词：

D O I：

10.1116/1.568467

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

收藏

页码：1086 / 1087

页数：2

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