ULTRA-DENSE - AN MCM-BASED 3-D DIGITAL SIGNAL PROCESSOR

被引:4
作者
SEGELKEN, JM
WU, LJ
LAU, MY
TAI, KL
SHIVELY, RR
GRAU, TG
机构
[1] AT&T Bell Laboratories, Murray Hill
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1992年 / 15卷 / 04期
关键词
D O I
10.1109/33.159871
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The DSP3 Multiprocessor Project at AT&T Bell Laboratories, sponsored by the Defense Advanced Research Projects Agency (DARPA), has produced a multi-GFLOP (10(9) FLoating Point OPerations per second) machine that is applicable to a variety of signal processing and pattern recognition problems. A companion DARPA sponsored program, the Ultra-Dense Project, is utilizing silicon-on-silicon multichip module (MCM) technology and innovative advanced packaging and physical design to achieve a parallel three-dimensional (3-D) digital signal processor based on the DSP3. This paper presents an overview and outlines systems architecture, Micro-Inter-connect Technology (Si-on-Si MCM), and unique innovative advances in physical design and packaging technology leading to an Ultra-Dense project demonstration.
引用
收藏
页码:438 / 443
页数:6
相关论文
共 4 条
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