HIGH-PERFORMANCE METAL SILICIDE ANTIFUSE

被引:17
作者
WANG, SJ
MISIUM, GR
CAMP, JC
CHEN, KL
TIGELAAR, HL
机构
[1] Semiconductor Process and Design Center, Texas Instruments Incorporated, Dallas
关键词
D O I
10.1109/55.192798
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter reports a low-programmed-resistance, low-thermal-budget, high-performance metal/silicide antifuse. The programmed ON-State resistance of the metal / silicide antifuse is around 60-OMEGA, which is a factor of 10 less than that of Si-based antifuses (poly / n + and poly / poly). Metal / silicide antifuses also eliminate the nonlinear ON-State resistance seen in Si-based antifuses. Programming of the antifuse can be done in 2 ms at 14 V, which is comparable to Si-based antifuses. Both ON- and OFF-state reliability of the metal / silicide antifuse are shown to be satisfactory.
引用
收藏
页码:471 / 472
页数:2
相关论文
共 6 条
[1]  
CHIANG S, 1990, P INT RELIABILITY PH, P186
[2]  
Hamdy E., 1988, International Electron Devices Meeting. Technical Digest (IEEE Cat. No.88CH2528-8), P786, DOI 10.1109/IEDM.1988.32929
[3]   SCALED DIELECTRIC ANTIFUSE STRUCTURE FOR FIELD-PROGRAMMABLE GATE ARRAY APPLICATIONS [J].
LIU, DKY ;
CHEN, KL ;
TIGELAAR, H ;
PATERSON, J ;
CHEN, SO .
IEEE ELECTRON DEVICE LETTERS, 1991, 12 (04) :151-153
[4]   HIGH-FREQUENCY TIME-DEPENDENT BREAKDOWN OF SIO2 [J].
ROSENBAUM, E ;
HU, CM .
IEEE ELECTRON DEVICE LETTERS, 1991, 12 (06) :267-269
[5]   EFFECTS OF POLY DEPLETION ON THE ESTIMATE OF THIN DIELECTRIC LIFETIME [J].
SHOUE, JW ;
CHEN, IC ;
TIGELAAR, HL .
IEEE ELECTRON DEVICE LETTERS, 1991, 12 (11) :617-619
[6]   OVERESTIMATE OF THIN DIELECTRIC LIFETIME IN SINGLE DOPING TYPE POLY-GATE CAPACITORS [J].
WANG, SJ ;
CHEN, IC ;
TIGELAAR, HL .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (12) :2723-2724